G11 high temperature epoxy resin fiberglass board is manufactured by fiberglass cloth impregnated with high temperature resistant epoxy resin, and it has good mechanical property and dielectric property.
Description of G11 High Temperature Epoxy Resin Fiberglass Board
IEC：EPGC203，JIS：EL-GEH，NEMA：G-11，
G11 high temperature epoxy resin fiberglass board is created by compressing fiberglass cloth, soaked in high temperature resistant epoxy resin under heat with excellent mechanical and dielectric properties, good mechanical performance at high temperature and high humidity condition, and good processability. The insulation class is H class, and the main color is yellow.
Application of G11 High Temperature Epoxy Resin Fiberglass Board
It can be used as insulating structural parts with heat resistance for electrical equipments such as circuit breakers, switch gear, transformers, DC motors, AC contactors, explosion-proof electrical appliances, electric furnace, electric melting furnace, etc. It can also be used for making structural support parts of switch and transformer, bus clamp plate, signal plate, partitions and lining plates of various switch gears, terminal plate, interphase insulation, bottom baffle, contact support parts, movable cover, slot wedge stator, fixed gasket, thin gasket, carbon brush, etc.
Thickness：0.5～50mm Specification：1020×1220mm;1020×2040mm;1220×2470mm
Advantage of G11 High Temperature Epoxy Resin Fiberglass Board
G11 high temperature epoxy resin fiberglass board produced by ZTelec Group has a low water absorption(almost zero), and its water absorption is only 0.09% after immersion for 24 hours. Its thermal resistant class reaches 180℃ and it can be operated normally in a long period of time at 180℃. It also has a strong mechanical processing performance and can be processed by compressing and cutting according to customer’s demands, meanwhile stable property, beautiful appearance and wide applications.
Property Parameter of G11 High Temperature Epoxy Resin Fiberglass Board
Executive Standard: GB-T 1303-2009 - IEC60893-2004
| Number | Item | Unit | Value |
| 1 | Density | g/cm3 | 1.8-1.95 |
| 2 | Water Absorption（Thickness:1-20mm） | mg | 17-73 |
| 3 | Flexural Strength at Perpendicular Lamination | MPa | ≥340 |
| （Under Normal） | |||
| 4 | Impact Strength at Parallel Lamination | KJ/m2 | ≥38 |
| （Simple Supported Beam） | |||
| 5 | Dielectric Strength at Perpendicular Lamination（Transformer Oil at 90℃）（Thickness:1mm） | KV/mm | ≥14.2 |
| 6 | Breakdown Voltage at Parallel Lamination | KV | ≥40 |
| （Transformer Oil at 90℃） | |||
| 7 | Dielectric Constant（50Hz） | - | ≤5.5 |
| 8 | Dielectric Loss Factor（50Hz） | - | ≤0.04 |
| 9 | Insulation Resistance after Immersion | Ω | ≥5.0×1010 |
| 10 | Proof Tracking Index(PTI) | - | ≥200 |
| 11 | Thermal Index | - | 180 |
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