Epoxy board is also called epoxy fiberglass board, epoxy phenolic laminated glass cloth board, model 3240. Epoxy resi...
Epoxy board is also called epoxy fiberglass board, epoxy phenolic laminated glass cloth board, model 3240. Epoxy resin refers to organic polymer compounds containing two or more epoxy groups in the molecule. Except for a few, their relative molecular mass is not high. The molecular structure of epoxy resin is characterized by the presence of active epoxy groups in the molecular chain. The epoxy groups can be located at the end, middle or ring structure of the molecular chain. Because the molecular structure contains active epoxy groups, they can react with various types of curing agents to form insoluble and infusible polymers with a three-dimensional network structure.
Application characteristics
1. Diverse forms. Various resins, curing agents, and modifier systems can almost meet the requirements of various applications for the form, ranging from extremely low viscosity to high melting point solids.
2. Convenient curing. Selecting a variety of different curing agents, the epoxy resin system can be cured in the temperature range of 0 to 180 ° C.
3. Strong adhesion. The presence of polar hydroxyl groups and ether bonds inherent in the epoxy resin molecular chain makes it highly adhesive to various substances. Epoxy resin has low shrinkage during curing and produces low internal stress, which also helps to improve adhesion strength.
4. Low shrinkage. The reaction between epoxy resin and the curing agent used is carried out by direct addition reaction or ring-opening polymerization of epoxy groups in the resin molecule, without the release of water or other volatile by-products. Compared with unsaturated polyester resins and phenolic resins, they show very low shrinkage (less than 2%) during the curing process.
5. Mechanical properties. The cured epoxy resin system has excellent mechanical properties.
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