Silicone Fiberglass Laminate (G7 Board) Detailed Overview

Product Introduction Silicone fiberglass laminate (G7 board) is a high-performance composite material formed by lami...

Product Introduction

Silicone fiberglass laminate (G7 board) is a high-performance composite material formed by laminating silicone resin (a heat-resistant polymer) with fiberglass cloth under high-temperature pressing. It combines the thermal stability and chemical resistance of silicone with the mechanical strength and electrical insulation of fiberglass, making it ideal for high-temperature, high-insulation industrial applications.

Key Characteristics

High Temperature Resistance

Continuous service temperature: 200–250°C; short-term tolerance up to 300°C+, outperforming standard epoxy-based materials (e.g., FR-4).

Superior Electrical Insulation

High dielectric strength (typical ≥20 kV/mm), low dielectric constant (3.0–4.0), suitable for high-frequency circuits and high-voltage equipment.

Outstanding Mechanical Properties

Flexural strength: ≥300 MPa; tensile strength: ≥200 MPa; fiberglass reinforcement ensures structural stability.

Chemical Resistance

Resists acids, alkalis, oils, and organic solvents, ideal for harsh chemical environments.

Low Water Absorption

Water absorption rate: <0.1%, ensuring stable performance in humid conditions.

High Flame Retardancy

UL94 V-0 rating, self-extinguishing, meets stringent fire safety standards.

 Technical Parameters (Typical Values)

Parameter	Value/Description
Density	1.6–1.8 g/cm³
Thermal Conductivity	0.2–0.3 W/(m·K)
Continuous Service Temp.	-60°C to +250°C
Dielectric Strength (1mm)	≥20 kV/mm
Volume Resistivity	≥10¹³ Ω·cm
CTE (Thermal Expansion)	10–15 ppm/°C (low anisotropy)
Flame Rating	UL94 V-0

Applications

1.Power Electronics

Insulation Components: Transformer bobbins, motor slot wedges, switchgear insulation plates.

Circuit Substrates: High-frequency PCB substrates (e.g., RF devices), heat-resistant electronic component supports.

2.Industrial Equipment

High-Temperature Environments: Welding machine insulation plates, heating equipment liners, furnace linings.

Corrosion-Resistant Parts: Sealing gaskets for chemical equipment, pump/valve insulation layers.

3.Rail Transportation & Aerospace

Lightweight Structures: Aircraft interior panels, high-speed rail insulation brackets, balancing strength and flame resistance.

4.New Energy Systems

Solar/Energy Storage: Insulating plates for inverters, battery module thermal barriers.

5.Specialized Applications

High-Temperature Molds: Composite material forming molds (temperature-resistant and dimensionally stable).

Comparison & Advantages

• vs. FR-4 Epoxy Boards: G7 offers higher temperature resistance (FR-4 limited to ~150°C) and superior flame retardancy, though at a higher cost.
• vs. Mica Boards: G7 provides better mechanical strength and machinability, suitable for complex structural parts.

Selection Guidelines

• High-Temperature Use: Prioritize G7 over standard epoxy materials.
• Precision Machining: G7 is compatible with CNC milling/drilling but requires carbide tools to minimize wear.
• Customization: Available in thicknesses from 0.5mm to 50mm, with optional single/double-sided copper cladding (for specialized PCBs).

G7 boards serve as a reliable solution for high-temperature, high-voltage, and high-insulation demands, particularly in mission-critical industrial applications. For tailored specifications, consult suppliers with detailed operational requirements.

ZTelec Group, a professional G7 board manufacturer with over 65 years of production experience, please feel free to contact us for more G7 board issues