Polyimide (PI) film insulation materials are widely used in spacecraft, rockets and missiles, navigation, atomic ener...
Polyimide (PI) film insulation materials are widely used in spacecraft, rockets and missiles, navigation, atomic energy, aviation, electronics and electrical fields. Film is one of the most common and successful products of polyimide.
Difference between tape and protective film
It is the excellent performance of polyimide film that makes it have unique applications. Tape consists of two parts: substrate and adhesive. By applying adhesive on the surface of the substrate, two or more unrelated objects are connected together. Protective film is a film that can protect fragile surfaces. Protective film is also a way of existence of tape, and there is no particularly obvious difference between the two.
Polyimide film in mobile phone components and applications
1. Soft board and steel bar
Flexible circuit board, also known as “soft board”, that is, FPC board, is printed on a flexible insulating substrate. Traditional flexible board is a multilayer structure consisting of copper foil, insulating substrate and covering film.
2. Graphite board
High thermal conductivity graphite film: polyimide film is prepared by carbonization and graphitization at 2800~3200℃. Corresponding to natural graphite film, it is also called artificial graphite film.
3. Cover film and lithium battery edge wrap
Cover film: used to cover and protect flexible circuits from high temperature, humidity, pollutants, corrosive gases and harsh environments. FPC black PI film requires a certain CTE value within 12.5 microns.
4. Shielding cover
The traditional shielding process is to stick a layer of insulating glue on the inner surface of a single PCS product after stamping, commonly known as “gluing”. This traditional process requires a lot of manpower, and requires complex processes such as die-cutting film, fixture design, and product fixing. The production yield is low and the flatness is difficult to control.
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