FR-4 epoxy plate filling solves super-thick copper inner lamination

FR-4 epoxy plates are available in yellow, white, black and other surface colors. It is the substrate that PCB use...

FR-4 epoxy plates are available in yellow, white, black and other surface colors. It is the substrate that PCB uses. According to different reinforcing materials, the sheet is mainly classified into the following four kinds: fr4: glass cloth substrate; fr1, fr2: paper substrates; CEM series: substrate composite substrate, special material (ceramic, metal, etc.); FR4 is a laminated product made of special electronic cloth dipped in epoxy phenolic resin and other materials by high temperature, high pressure and hot pressing.

What is FR-4 laminate sheet? FR-4 epoxy plate has high mechanical properties and dielectric properties, good heat and moisture resistance, and good machinability.

Application: FR-4 epoxy sheet can be used as insulating structural parts of motor and electrical equipment, including various types of switches, FPC reinforcement, electrical insulation, carbon film printed circuit board, computer drilling pad, mold insulation, fixtures, etc. (PCB test rack), and can be used in humid environment and transformer oil.

FR-4 epoxy plate filling solves super-thick copper inner lamination

Super-thick copper inner layer superposition: it is difficult to achieve the thickness of super thick copper if copper foil is used. The super thick copper inner layer adopts 1 mm electrolytic copper plate, which is a conventional material that is easy to purchase and is directly processed and formed by milling machine. The outer contour of the copper plate in the inner layer is processed and formed by FR4 plate (glass fiber epoxy resin plate) of the same thickness as the overall filling. In order to facilitate the stacking and ensure the close fit with the copper plate, the gap between the two profiles is controlled within 0~ 0.2mm. Under the filling action of FR4 plate, the copper thickness problem of ultra-thick copper plate is solved, and the compaction and internal insulation problems after lamination are ensured, so that the copper thickness of the inner layer can be designed to be greater than 0.5mm.

(1) Ultra-thick copper inner layer lamination technology: it effectively solves the problem of selection of ultra-thick copper materials, and the pre-milling processing does not need etching, which effectively avoids the problem of thick copper plate etching technology; FR-4 filling technology ensures tight compaction and difficult insulation of the inner layer;

(2) Ultra-thick copper PCB laminating technology: it effectively solves the problem of laminating white spots and delamination, and finds a new laminating way and solution;

(3) Glue flow control technology for ultra-thick copper PCB: it effectively solves the problem of glue flow after pressing, and ensures the implementation of pre-milling shape and re-pressing process.